Wednesday, March 18, 2020

Electronics should sweat to cool down, say researchers

Computing devices should sweat when they get too hot, say scientists at Shanghai Jiao Tong University in China, where they have developed a materials application they claim will cool down devices more efficiently and in smaller form-factors than existing fans.

It’s “a coating for electronics that releases water vapor to dissipate heat from running devices,” the team explain in a news release. “Mammals sweat to regulate body temperature,” so should electronics, they believe.

The group’s focus has been on studying porous materials that can absorb moisture from the environment and then release water vapor when warmed. MIL-101(Cr) checks the boxes, they say. The material is a metal organic framework, or MOF, which is a sorbent, a material that stores large amounts of water. The higher the water capacity one has, the greater the dissipation of heat when it's warmed.

To read this article in full, please click here

Thanks to Patrick Nelson (see source)

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